Control Of Key Parameters For Threaded Fastener Bonding

Jul 06, 2026

‌Temperature and Humidity‌: It is recommended to maintain the curing environment at a temperature of 15–35°C and a humidity level of ≤70%. Low temperatures prolong curing time, while high temperatures may cause adhesive sagging or a decline in performance.


‌Application Amount‌: Excessive application may lead to adhesive overflow and contamination of other components, whereas insufficient application compromises sealing effectiveness. The optimal application amount should be determined through testing; for example, for M10 threads, the amount per application is approximately 0.5–1 mL.


‌Curing Time‌: Insufficient curing time results in inadequate bond strength, while an excessively long duration may impact production efficiency. Curing times should be adjusted dynamically based on the adhesive type and environmental conditions, and the curing results verified through tensile testing.